FilingReader Intelligence
Fudan Microelectronics signs 3.5m yuan university research deal
July 28, 2025 at 12:31 PM UTC•By FilingReader AI
Shanghai Fudan Microelectronics Group has entered a technology services agreement with Fudan University worth 3.5 million yuan.
Under the 18-month deal running through December 2026, the university will conduct research and development on ultra-large scale FPGA layout and routing technology.
Payment will be split equally, with half due 30 days after signing and the remainder upon acceptance of research results.
This report was generated by FilingReader's AI system from regulatory filings and company disclosures. To request a correction, contact editorial@filingreader.com
HKEX:1385•Hong Kong Exchange
News Alerts
Get instant email alerts when Shanghai Fudan Microelectronics Group Company publishes news
Free account required • Unsubscribe anytime