FilingReader Intelligence
Hengtai Securities plans bond issues, seeks shareholder approval
July 8, 2025 at 10:29 AM UTC•By FilingReader AI
Hengtai Securities Co is set to hold its 2025 third extraordinary general meeting (EGM) on July 25, 2025, in Beijing, seeking shareholder approval for a series of proposed bond issues. The resolutions include the proposed issuance of science and technology innovation corporate bonds, along with science and technology innovation subordinated bonds in the PRC. Additionally, the company aims to secure approval for issuing short-term corporate bonds in the PRC.
This report was generated by FilingReader's AI system from regulatory filings and company disclosures. To request a correction, contact editorial@filingreader.com
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HKEX:1476•Hong Kong Exchange
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