Hengtai Securities plans new bond issues and EGM

Hengtai Securities announced plans to issue science and technology innovation corporate bonds (STI Corporate Bonds) and science and technology innovation subordinated bonds (STI Subordinated Bonds) in the People’s Republic of China (PRC). The total proceeds raised from these STI bonds will not exceed RMB1,000 million (inclusive). The bonds will mature in three years and will be non-publicly issued to professional investors. At least 70% of the proceeds will be used to support technological innovation business, with the remainder to replenish working capital.